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TB2936HQ 2009-02-04 1 toshiba bi-cmos linear integrat ed circuit silicon monolithic TB2936HQ 49 w 4-ch btl audio power ic the TB2936HQ is a four-channel btl power amplifier for car audio applications. this ic has a pure complementary p-ch and n-ch dmos output stage, offering maximum output power (p out max) of 49 w. it includes a standby switch , mute function and various protection features. features ? high output power ? p out max (1) = 49 w (typ.) (v cc = 15.2 v, f = 1 khz, jeita max, r l = 4 ) ? p out max (2) = 43w (typ.) (v cc = 14.4 v, f = 1 khz, jeita max, r l = 4 ) ? p out (1) = 26 w (typ.) (v cc = 14.4 v, f = 1 khz, thd = 10%, r l = 4 ) ? p out (2) = 23 w (typ.) (v cc = 13.2 v, f = 1 khz, thd = 10%, r l = 4 ) ? low thd: 0.015% (typ.) (v cc = 13.2 v, f = 1 khz, p out = 5 w, r l = 4 ) ? low noise: v no = 160 vrms (typ.) (v cc = 13.2 v, r g = 0 , bw = 20 hz to 20 khz, r l = 4 ) ? standby switch (pin 4) ? mute function (pin 22) ? output dc offset detection and clip detection (pin 25) ? various protection features thermal overload; overvoltage; ou tput short-circuits to gnd, v cc and across the load; speaker current limiting ? operating supply voltage: v cc (opr) = 8.0 to 18 v (r l = 4 ) note 1: install the device correctly. otherwise, the device or system may be degraded, damaged or even destroyed. note 2: the protection features are intended to avoid output short-circuits or ot her abnormal conditions temporarily. it is not guaranteed that they will prevent the ic from being damaged. exposure to conditions beyond the guaranteed operati ng ranges may not activate the protection features, resulting in an ic damage due to output short-circuits. weight: 7.7 g (typ.)
TB2936HQ 2009-02-04 2 block diagram some of the functional blocks, circui ts or constants may be omitted from the block diagram or simplified for explanatory purposes. 5 v 1 10 6 20 v cc1 v cc2 tab ripple c2 +b c3 c5 9 out1 ( +) 11 c1 8 7 pw-gnd1 out1 ( ?) in1 5 out2 ( +) 12 c1 2 3 pw-gnd2 out2 ( ?) in2 17 out3 ( +) 15 18 19 pw-gnd3 out3 ( ?) in3 21 out4 ( +) 14 c1 24 23 pw-gnd4 out4 ( ?) in4 13 16 c1 c6 4 stby 25 22 mute c4 r1 play mute r l r l r l r l pre-gnd a c-gnd offset/short
TB2936HQ 2009-02-04 3 detailed description (the following only describes one of the four channels, since all these channels are symmetrical.) 1. standby switch (pin 4) the power supply can be turned on or off via pin 4 (stby). the threshold voltage of pin 4 is set at about 3 v be (typ.). the power supply current is about 0.01 a (typ.) in the standby state. standby control voltage (v sb ): pin 4 standby power v sb (v) on off 0 to 0.9 off on 2.9 to vcc check the pop levels when the time constant of pin 4 is changed. benefits of the standby switch (1) v cc can be directly turned on or off by a microcont roller, eliminating the need for a switching relay. (2) since the control current is minuscule, a low-current-rated switching relay can be used. figure 2 standby switch v cc low-current-rated switch battery standby v cc from microcontroller battery standby ? using the standby switch ? ? conventional method ? v cc high-current-rated switch battery v cc from microcontroller battery relay figure 1 setting pin 4 high turns on power on 4 off 10 k to bias filter network 2 v be v cc powe r
TB2936HQ 2009-02-04 4 2. mute function (pin 22) the audio mute function is en abled by setting pin 22 low. r 1 and c 4 determine the time constant of the mute function. the time constant affects pop noise gene rated when power or the mute function is turned on or off; thus, it must be determined on a per-application basis. (refer to figures 3 and 4.) the value of the external pull-up resistor is determined, based on pop noise value. for example, when the control voltage is changed fr om 5 v to 3.3 v, the pull-up resistor should be: 3.3 v / 5 v 47 k = 31 k figure 3 mute function figure 4 mute attenuation ? v mute (v) 22 1 k r 1 5 v mute on/off control c 4 0 ? 120 ? 100 ? 80 ? 60 ? 40 ? 20 0 20 0.5 1 1.5 2 2.5 3 v cc = 13.2 v f = 1 khz r l = 4 v o = 20dbm bw = 400 hz to 30 khz pin 22 control voltage: v mute (v) att ? v mute mute attenuation att (db)
TB2936HQ 2009-02-04 5 3. dc offset detection the purpose of the integrated dc offset detector is to avoid an anomalous dc offset on the outputs, produced by the input capacitor due to leakage current or short-circuit. figure 5 dc offset detection mechanism amp output out(-) v cc /2 gnd gnd time gnd voltage at (a) (pin 25) offset detection threshold voltage r s2 time time voltage at (b) (lpf output) out(+) v re f elec. vol 25 5 v lpf to a microcontroller + ? v negative dc offset ( ?) (caused by r s2 ) positive dc offset ( +) (caused by r s1 ) v cc /2 (normal dc voltage) leakage current or short-circuit v bias v ref/2 a b r s2 r s1 the microcontroller shuts down the system if the output is lower than the specified voltage.
TB2936HQ 2009-02-04 6 4. clip detection pin 25 is an open-collector output (a ctive-low) as shown in figure 6. when the output voltage waveform is clipped, the in ternal clip detector is activated so that the npn transistor q1 is enabled. the sound quality can be improved by controlling the vo lume and tone control circuitry using this output signal. pin 25 should be left open when this feature is not required. figure 6 open-collector output of pin 25 figure 7 waveform of pin 25 upon offset and clip detections 10 k diag pin 10 k vosdet clipdet 0.0 2.0 6.0 4.0 0.0 0.0 5.0 15.0 10.0 500 1.0 m pin 25dc operation output waveform (v out ) 5 v ????r ???r t ime ( s ) (v) (v) vos & clip detector
TB2936HQ 2009-02-04 7 5. prevention of speaker damage (in case of a layer short-circuit of the speaker) when the dc resistance between the out + and out ? pins falls below 1 , the output current exceeds 4 a. at this time, the protection circuit is activate d to limit the current draw into the speaker. this feature prevents the speaker from being damaged, as follows: < speaker damaging scenario > a dc current of over 4 v is applied to the spea ker due to an external circuit failure (note 4). (abnormal dc output offset) the speaker impedance becomes 1 or less due to a layer short. a current of over 4 a flows into the speaker, damaging the speaker. figure 8 note 4: an abnormal dc offset voltage is incurred when t he input bias to the power ic is lost due to a leakage current from a coupling capacitor at the input or a short-circuit between the in and adjacent lines. current into the speaker speaker impedance less than 4 a about 1 4 the short-circuit prot ection is activated
TB2936HQ 2009-02-04 8 6. pop noise suppression since the TB2936HQ uses the ac-gnd pin (pin 16) as the common input reference voltage pin for all amplifiers, the ratio of the input capacitance (c1) to the ac-to-gnd capacitance (c6) should be 1:4. also, if power is removed before c1 and c6 are comple tely charged, pop noise will be generated because of unbalanced dc currents. to avoid this problem, it is recommended to use a larger capacitor as c2 to increase the charging times of c1 and c6. note, however, that c2 also affects the time required from power-on to audio output. the pop noise generated by the muting and unmuting of the audio output varies wi th the time constant of c4. a larger capacitance reduces the pop noise, but incre ases the time from when th e mute control signal is applied to c4 to when the mute function is enabled. 7. external component constants effects component recommended value purpose when lower than recommended value when higher than recommended value notes c1 0.22 f to eliminate dc cut-off frequency is increased. cut-off frequency is reduced. pop noise is generated when v cc is turned on. c2 10 f to reduce ripple powering on/off is faster. powering on/off is slower. c3 0.1 f to provide sufficient oscillation margin reduces noise and provides su fficient oscillation margin c4 1 f to reduce pop noise high pop noise. duration until mute function is turned on/off is short. low pop noise. duration until mute function is turned on/off is long. c5 3900 f ripple filter power supply humming and ripple filtering. c6 1 f common reference voltage for all input pop noise is suppressed when c1: c6 = 1:4. pop noise is generated when v cc is turned on.
TB2936HQ 2009-02-04 9 absolute maximum ratings (ta = 25c) characteristics symbol rating unit peak supply voltage (0.2 s) v cc (surge) 50 v dc supply voltage v cc (dc) 25 v operating supply voltage v cc (opr) 18 v output current (peak) i o (peak) 9 a power dissipation p d (note 5) 125 w operating temperature t opr ? 40 to 85 c storage temperature t stg ? 55 to 150 c note 5: package thermal resistance j-t = 1c/w (typ.) (ta = 25c, with infinite heat sink) the absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. if any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered and the reliability and life time of the device can no longer be guaranteed. moreover, any exceeding of the ratings during oper ation may cause breakdown, damage and/or degradation in other equipment. applications using the device sh ould be designed so that no absolute maximum rating will ever be exceeded under any operating conditions. before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document. electrical characteristics (v cc = 13.2 v, f = 1 khz, r l = 4 , ta = 25c unless otherwise specified) characteristics symbol te s t circuit test condition min typ. max unit quiescent supply current i ccq ? v in = 0 ? 160 320 ma p out max (1) ? v cc = 15.2 v, max power ? 49 ? p out max (2) ? v cc = 14.4 v, max power ? 43 ? p out max (3) ? v cc = 13.7 v, max power ? 39 ? p out (1) ? v cc = 14.4 v, thd = 10% ? 26 ? output power p out (2) ? thd = 10% 21 23 ? w total harmonic distortion thd ? p out = 5 w ? 0.015 0.08 % voltage gain g v ? v out = 0.775 vrms 33 34 35 db channel-to-channel voltage gain g v ? v out = 0.775 vrms ? 1.0 0 1.0 db v no (1) ? r g = 0 , din45405 ? 160 ? output noise voltage v no (2) ? r g = 0 , bw = 20 hz to 20 khz ? 160 250 vrms ripple rejection ratio r.r. ? f rip = 100 hz, r g = 620 , v rip = 0.775 vrms 45 52 ? db crosstalk c.t. ? r g = 620 , p out = 4w ? 67 ? db output offset voltage v offset ? ? ? 185 0 185 mv output offset voltage while the mute function is turned on/off v os ? ? ? 85 0 85 mv input resistance r in ? ? ? 30 ? k standby current i sb ? standby condition, v4 = 0, v22 = 0 ? 0.01 1 a v sb h ? power: on 2.9 ? v cc standby control voltage v sb l ? power: off 0 ? 0.9 v
TB2936HQ 2009-02-04 10 characteristics symbol te s t circuit test condition min typ. max unit v m h ? mute: off 2.9 ? v cc mute control voltage v m l ? mute: on, r 1 = 47 k 0 ? 0.9 v mute attenuation att m ? mute: on,din_audio v out = 7.75 vrms mute: off 85 100 ? db clip detection threshold cld-det ? when pin 25 = low ? 1 5 % upper cut-off frequency f th ? g v = 26db, 3db ? 250 ? khz dc offset threshold voltage v off-set ? rpull-up = 10 k , + v = 5.0 v out ( + )-out ( ?) 1.0 1.5 2.0 v pin 25 saturation voltage (at each detector on condition) p25-sat ? rpull-up = 10 k , + v = 5.0 v (pin 25 = low) ? 100 500 mv test circuit components in the test circuit are only used to determine the device characteristics. it is not guaranteed that the system w ill work properly with these components. 5 v 1 10 6 20 v cc1 v cc2 tab ripple c2: 10 f +b c3: 0.1 f c5: 3900 f 9 out1 ( +) 11 c1: 0.22 f 8 7 pw-gnd1 out1 ( ?) in1 5 out2 ( +) 12 2 3 pw-gnd2 out2 ( ?) in2 17 out3 ( +) 15 18 19 pw-gnd3 out3 ( ?) in3 21 out4 ( +) 14 24 23 pw-gnd4 out4 ( ?) in4 13 16 c6: 1 f 4 stby 25 22 mute c4: 1 f r1: 47 k play mute r l = 4 ohm pre-gnd a c-gnd offset/short c1: 0.22 f c1: 0.22 f c1: 0.22 f r l = 4 ohm r l = 4 ohm r l = 4 ohm
TB2936HQ 2009-02-04 11 20 khz 10 khz 1 khz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 f = 100 hz v cc = 13.2 v r l = 4 filter 100 hz : to 30 khz 1 khz : 400 hz to 30 khz 10 khz : 400 hz to 20 khz : 400 hz to 20 khz 10 khz 1 khz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 f = 100 hz v cc = 13.2 v r l = 4 filter 100 hz : to 30 khz 1 khz : 400 hz to 30 khz 10 khz : 400 hz to 20 khz : 400 hz to 20 khz 10 khz 1 khz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 v cc = 13.2 v r l = 4 filter 100 hz : to 30 khz 1 khz : 400 hz to 30 khz 10 khz : 400 hz to 20 khz : 400 hz to f = 100 hz 20 khz 10 khz 1 khz 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 f = 100 hz v cc = 13.2 v r l = 4 filter 100 hz : to 30 khz 1 khz : 400 hz to 30 khz 10 khz : 400 hz to 20 khz : 400 hz to thd ? p out (ch1) thd ? p out (ch2) output power p out (w) output power p out (w) total harmonic distortion thd (%) total harmonic distortion thd (%) thd ? p out (ch3) thd ? p out (ch4) total harmonic distortion thd (%) total harmonic distortion thd (%) output power p out (w) output power p out (w)
TB2936HQ 2009-02-04 12 13.2 v 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 v cc = 13.2 v r l = 4 filter 400 hz to 30 khz v cc = 9 v 16 v 13.2 v 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 v cc = 13.2 v r l = 4 filter 400 hz to 30 khz v cc = 9 v 16 v 13.2 v 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 v cc = 13.2 v r l = 4 filter 400 hz to 30 khz v cc = 9 v 16 v 13.2 v 0.1 100 0.001 0.3 1 30 0.5 10 3 5 50 0.01 0.1 0.003 0.005 0.03 0.05 1 0.3 0.5 10 30 100 50 3 5 v cc = 13.2 v r l = 4 filter 400 hz to 30 khz v cc = 9 v 16 v thd ? p out (ch1) thd ? p out (ch2) output power p out (w) output power p out (w) total harmonic distortion thd (%) total harmonic distortion thd (%) thd ? p out (ch3) thd ? p out (ch4) output power p out (w) output power p out (w) total harmonic distortion thd (%) total harmonic distortion thd (%)
TB2936HQ 2009-02-04 13 frequency f (hz) muteatt ? f mute attenuation muteatt (db) frequency f (khz) r.r. ? f ripple rejection ratio r.r. (db) frequency f (khz) g v ? f voltage gain g v (db) total harmonic distortion thd (%) frequency f (khz) thd ? f 1 0.3 4 ch 2 ch 3 ch 1 ch v cc = 13.2 v r l = 4 p out = 5 w 1ch input no filter 0.1 0.01 100 0.001 1 10 0.003 0.01 0.03 0.1 3 v cc = 13.2 v r l = 4 v out = 0.775 vrms (0dbm) 0.1 0.01 100 0 1 10 10 20 30 40 1 ch to 4 ch v cc = 13.2 v r l = 4 vrip = 0.775 vrms (0dbm) 0.1 0.01 100 ? 80 1 10 ? 60 ? 40 ? 20 0 1 ch to 4 ch v cc = 13.2 v r l = 4 v out = 7.75 vrms (20dbm) 100 10 100 k ? 120 1 k 10 k ? 100 ? 80 ? 60 ? 40 ? 20 0 1 ch~4 ch
TB2936HQ 2009-02-04 14 output power p out (w) input voltage v in (vrms) v in ? p out (ch1) output power p out (w) input voltage v in (vrms) v in ? p out (ch2) output power p out (w) input voltage v in (vrms) v in ? p out (ch3) output power p out (w) input voltage v in (vrms) v in ? p out (ch4) supply voltage v cc (v) i ccq ? v cc quiescent current i ccq (ma) ambient temperature ta (c) p d max ? ta allowable power dissipation p d max (w) (1) (2) (3) 25 0 150 0 120 75 60 100 40 20 80 100 50 125 (1) infinite heat sink r jc = 1 c/w (2) heat sink (r hs = 3.5 c/w r jc + r hs = 4.5 c/w (3) no heat sink r ja = 39 c/w 0 0 2 4 6 8 10 10 20 30 40 v cc = 13.2 v r l = 4 no filter 20 khz 1 khz 10 khz 100 hz 0 0 2 4 6 8 10 10 20 30 40 v cc = 13.2 v r l = 4 no filter 10 khz 20 khz 100 hz 1 khz 0 0 2 4 6 8 10 10 20 30 40 v cc = 13.2 v r l = 4 no filter 20 khz 100 hz 10 khz 1 khz 0 0 2 4 6 8 10 10 20 30 40 v cc = 13.2 v r l = 4 no filter 20 khz 10 khz 100 hz 1 khz 200 0 0 r l = v in = 0 v 5 10 15 20 25 40 80 120 160
TB2936HQ 2009-02-04 15 0 0 5 10 15 20 30 20 40 60 80 f = 1 khz r l = 4 4ch drive v cc = 9.0 v 13.2 v 16 v 18 v 25 output noise voltage v no ( vrms) cross talk c.t. (db) frequency f (hz) c.t. ? f (ch1) cross talk c.t. (db) frequency f (hz) c.t. ? f (ch2) cross talk c.t. (db) frequency f (hz) c.t. ? f (ch3) cross talk c.t. (db) frequency f (hz) c.t. ? f (ch4) signal source resistance r g ( ) v no ? r g output power p out (w) p d ? p out power dissipation p d (w) v cc = 13.2 v r l = 4 v out = 0.775 vrms (0dbm) r g = 620 0 ? 80 10 ct (1-2) ? 60 ? 40 ? 20 100 1 k 10 k 100 k ct (1-4) ct (1-3) v cc = 13.2 v r l = 4 v out = 0.775 vrms (0dbm) r g = 620 0 ? 80 10 ct (3-1) ? 60 ? 40 ? 20 100 1 k 10 k 100 k ct (3-4) ct (3-2) v cc = 13.2 v r l = 4 v out = 0.775 vrms (0dbm) r g = 620 0 ? 80 10 ct (4-1) ? 60 ? 40 ? 20 100 1 k 10 k 100 k ct (4-2) ct (4-3) v cc = 13.2 v r l = 4 filter: 20 hz to 20 khz 100 10 100 k 0 1 k 10 k 100 200 300 1ch to 4ch v cc = 13.2 v r l = 4 v out = 0.775 vrms (0dbm) r g = 620 0 ? 80 10 ct (2-1) ? 60 ? 40 ? 20 100 1 k 10 k 100 k ct (2-3) ct (2-4)
TB2936HQ 2009-02-04 16 application circuit (emc-compliant) the devices used in the test circuit are intended to be used only for verifying the characte ristics of the device. it is not guaranteed that this application equipment works properly. 5 v 1 10 6 20 v cc1 v cc2 tab ripple c2: 10 f +b c3: 0.1 f c5: 3900 f 9 out1 ( +) 11 c1: 0.22 f 8 7 pw-gnd1 out1 ( ?) in1 5 out2 ( +) 12 2 3 pw-gnd2 out2 ( ?) in2 17 out3 ( +) 15 18 19 pw-gnd3 out3 ( ?) in3 21 out4 ( +) 14 24 23 pw-gnd4 out4 ( ?) in4 13 16 c6: 1 f 4 stby 25 22 mute c4: 1 f r1: 47 k play mute r l = 4 ohm pre-gnd a c-gnd offset/clip c1: 0.22 f c1: 0.22 f c1: 0.22 f r l = 4 ohm r l = 4 ohm r l = 4 ohm c7 c7 c7 c7 c7 c7 c7 c7 c7: 1000 pf
TB2936HQ 2009-02-04 17 test board layout for toshiba 4-channel power circuitry the layout diagrams below illustrate the front and back sides of the test board ?rp-2024? for testing toshiba?s 4-channel power circuitry, which is housed in a hzip25-p-1.00f (spp25) package. note: this test board is designed to be used for several po wer amplifiers. therefore, devices that are externally connected to the power amplifier to be tested mu st be checked before setti ng up the test board. front side back side
TB2936HQ 2009-02-04 18 package dimensions weight: 7.7 g (typ.)
TB2936HQ 2009-02-04 19 ? use an appropriate power supply fuse to ensure that a lar ge current does not continuously flow in case of over current and/or ic failure. the ic will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and t he breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. ? if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power on or the negative current resulting from t he back electromotive force at power off. for details on how to connect a protection circuit such as a current limiting resistor or ba ck electromotive force adsorption diode, refer to individual ic datasheets or the ic databook. ic breakdown may cause injury, smoke or ignition. ? use a stable power supply with ics with built-in protection functions. if the power supply is unstable, the protection function may not operate, causing ic breakdown. ic breakdown may cause injury, smoke or ignition. ? carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, powe r amp and regulator. if there is a lar ge amount of leakage current such as input or negative feedback condenser, the ic output dc voltage will increase. if this output voltage is connected to a speaker with low input withstand voltage, overcurrent or ic failure can cause smoke or ignition. (the over current can cause smoke or ignition from the ic itself.) in particular, please pay attention when using a bridge tied load (btl) connection type ic that inputs output dc voltage to a speaker directly. ? over current protection circuit over current protection circuits (referred to as current li miter circuits) do not necessarily protect ics under all circumstances. if the over current protec tion circuits operate against the over cu rrent, clear the over current status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current pr otection circuit to not operate properly or ic breakdown before operation. in addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the ic may generate heat resulting in breakdown. ? thermal shutdown circuit thermal shutdown circuits do not necessarily protect ic s under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maxi mum ratings can cause the thermal shutdown circuit to not operate properly or ic breakdown before operation. ? heat radiation design when using an ic with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specifi ed junction temperature (tj) at any time and condition. these ics generate heat even during normal use. an inadequate ic heat radiat ion design can lead to decrease in ic life, deterioration of ic characte ristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat r adiation with peripheral components. ? installation to heat sink please install the power ic to the heat sink not to apply excessive mechanical stress to the ic. excessive mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal ic chip. in addition, depending on the ic, the use of silicon rubber may be prohibited. check whether the use of silicon rubber is prohibited for the ic you intend to use, or not. for details of power ic heat radiation design and heat sink installation, refer to individual technical datasheets or ic databooks. about solderability, following conditions were confirmed ? solderability (1) use of sn-37pb solder bath solder bath temperature = 230c dipping time = 5 seconds the number of times = once use of r-type flux (2) use of sn-3.0ag-0 .5cu solder bath solder bath temperature = 245c dipping time = 5 seconds the number of times = once use of r-type flux
TB2936HQ 2009-02-04 20 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduction is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product?s quality a nd reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid sit uations in which a malfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all relev ant toshiba information, including without limitation, this docume nt, the specifications, the data sheets and applicat ion notes for product and the precautions and conditions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operati ng parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limit ation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equi pment used for automobiles, trains, ships and other transportation, traffic signalin g equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fi elds. do not use product for unintended us e unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability wh atsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any m ilitary purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technolog y products (mass destruction weapons). product and related softwa re and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. export administration regulations. export and re-export of product or related softw are or technology are strictly prohibited except in comp liance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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